JPS5632400B2 - - Google Patents

Info

Publication number
JPS5632400B2
JPS5632400B2 JP10327872A JP10327872A JPS5632400B2 JP S5632400 B2 JPS5632400 B2 JP S5632400B2 JP 10327872 A JP10327872 A JP 10327872A JP 10327872 A JP10327872 A JP 10327872A JP S5632400 B2 JPS5632400 B2 JP S5632400B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10327872A
Other languages
Japanese (ja)
Other versions
JPS4866036A (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4866036A publication Critical patent/JPS4866036A/ja
Publication of JPS5632400B2 publication Critical patent/JPS5632400B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP10327872A 1971-12-10 1972-10-17 Expired JPS5632400B2 (en])

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US20682271A 1971-12-10 1971-12-10

Publications (2)

Publication Number Publication Date
JPS4866036A JPS4866036A (en]) 1973-09-11
JPS5632400B2 true JPS5632400B2 (en]) 1981-07-27

Family

ID=22768127

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10327872A Expired JPS5632400B2 (en]) 1971-12-10 1972-10-17

Country Status (9)

Country Link
US (1) US3770594A (en])
JP (1) JPS5632400B2 (en])
BE (1) BE789028A (en])
CA (1) CA982080A (en])
DE (1) DE2248431A1 (en])
FR (1) FR2162362B1 (en])
GB (1) GB1366419A (en])
IT (1) IT971103B (en])
NL (1) NL7216355A (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0270313U (en]) * 1988-11-16 1990-05-29

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53110989A (en) * 1977-03-10 1978-09-28 Inoue Japax Res Inc Electrolytic gas generator for oxyhydrogen flame
GB2118973A (en) * 1982-04-27 1983-11-09 Corrintec Uk Ltd Electrical connector and manufacture thereof
US5270229A (en) * 1989-03-07 1993-12-14 Matsushita Electric Industrial Co., Ltd. Thin film semiconductor device and process for producing thereof
SG87208A1 (en) * 2000-03-08 2002-03-19 Applied Materials Inc Method for electrochemical deposition of metal using modulated waveforms
US20030201185A1 (en) * 2002-04-29 2003-10-30 Applied Materials, Inc. In-situ pre-clean for electroplating process
US20060113192A1 (en) * 2003-01-23 2006-06-01 Keiichi Kurashina Plating device and planting method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1527734A (en) * 1922-12-14 1925-02-24 Electrolytic Corp Apparatus and method for electrolytically depositing metals
GB406767A (en) * 1932-09-21 1934-03-08 Grace Ellen Adey A process and apparatus for effecting the electro-deposition of metals
US2726203A (en) * 1955-06-06 1955-12-06 Robotron Corp High voltage electro-plating method
US3622469A (en) * 1968-07-10 1971-11-23 Ibm Method for edge-plating coupled film devices
AU1808570A (en) * 1969-08-04 1972-02-03 Allis-Chalmers Manufacturing Company Electrochemical deposition of metals or alloys

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0270313U (en]) * 1988-11-16 1990-05-29

Also Published As

Publication number Publication date
GB1366419A (en) 1974-09-11
US3770594A (en) 1973-11-06
FR2162362A1 (en]) 1973-07-20
NL7216355A (en]) 1973-06-13
FR2162362B1 (en]) 1976-08-20
JPS4866036A (en]) 1973-09-11
BE789028A (fr) 1973-01-15
DE2248431A1 (de) 1973-06-14
CA982080A (en) 1976-01-20
IT971103B (it) 1974-04-30

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